MobiNav

鲍虎军等 863-13主题专家组 (source : GIS探索者)

　　地理信息系统(Geographic Information System，GIS)是能够收集、管理、查询、分析、操作以及表现与地理相关的数据信息的计算机信息系统，能够为分析、决策提供重要的支持平台。它广泛地应用于地学、资源管理、土地规划、环境监测、防灾减灾、电力行业、交通管理、城市规划、科研、教育和国防等领域，在我国国民经济建设中发挥着越来越重要的作用。
　　当前，随着信息技术的发展以及应用领域的不断扩大，地理信息系统技术得到了飞速的发展。由于GIS是“关系到国家安全的战略性技术”，因此开发拥有自主知识产权的国产GIS系统平台，研究和掌握GIS中的前沿关键技术，对我国GIS的发展和应用有着非常重要的意义。本报告介绍和分析了当前国内外GIS相关技术的发展现状和趋势，讨论了我国发展地理信息系统技术应采取的对策以及本主题的相关工作部署。

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WAAS(Wide Area Augmentation System), 即广域增强系统。WAAS是美国联邦航空局（FAA）及美国交通部为提升飞行精确度而发展出来的，因为目前单独使用 GPS 并无法达到联邦航空局针对精确飞行导航所设定的要求。WAAS 包含了约25个地面参考站台，位置散布于美国境内，负责监控 GPS 卫星的资料。其中两个分别位于美国东西岸的主站台搜集其它站台传来的资料，并据此计算出 GPS 卫星的轨道偏移量、电子钟误差，以及由大气层及电离层所造成的讯息延迟时间，汇整后经由两颗位在赤道上空之同步卫星的其中之一传播出去。此 WAAS 讯号的发送频率与 GPS 讯号的频率相同，因此任何具备 WAAS 功能的 GPS 机台都可接收此讯号，并藉此修正定位信息。WAAS 可以校正由电离层干扰、时序控制不正确以及卫星轨道错误等因素所造成的 GPS 讯号误差，也能提供各卫星是否正常运转之信息。虽然 WAAS 目前尚未正式通过美国航空局的飞行使用认证，但此系统已开放给一般民众使用，例如从事航海或其它休闲活动的人们。

目前无WAAS功能的普通GPS接收机的正常精确度是15米，而一台具备WAAS功能的GPS接收机能在95%的情况下提供您误差小于三公尺的精准定位，而且您不必为了使用WAAS功能而支付任何使用费。

目前，WAAS 卫星讯号的适用范围只有北美洲。在其他地方并无任何地面参考站台，所以这些地区的 GPS 使用者就算能接收到 WAAS 讯号，也会因为讯号没经过适当的校正而无法提升其机台的精确度。即使在美国，由于卫星位于赤道上空的缘故，若所在位置之南方地平线有树林或山脉阻挡，也会不容易收到 WAAS 讯号 

EGNOS(European Geostationary Navigation Overlay Service), 即“欧洲静止轨道导航重叠系统”是欧洲全球卫星导航系统的开端。它是由欧空局、欧盟和欧洲空间安全组织共同发起的，是目前正在欧洲建立的伽利略全球卫星导航定位系统的先驱。

EGNOS的地面设施和静止卫星也没有覆盖到亚、非、南美和远东等地区。所以，中国国内还无法使用EGNOS的精确定位服务。

One can view the contents of nk.bin by using the viewbin utility.

But one can neither extract a file from nor insert new files to the image. One MUST be working with the OEM, so as to ask them to add the component, or for a binary release of the their BSP.

Automated Collision Notification (ACN) Report (2001), National Hightway Traffic Safty Administration, US Department of Transportation, Washington, D.C., USA

Digital Baseband – Availability Disclaimer
The OMAP850 is a single chip that integrates a ARM926EJ-S™ core for applications processing and TI’s EDGE digital baseband modem. It is intended for high-volume wireless OEMs and ODMs and is not available through distributors.

The OMAP850 includes all of the features of the OMAP850 and adds support for 128Mb or 256Mb of stacked mobile SDRAM. This makes the OMAP850 well-suited for space-constrained systems or for even smaller, lighter mobile device designs. It also consumes less power than traditional external memory configurations.

With this kind of flexibility, mobile device manufacturers can further reduce the size of high-end, next generation smartphone and wireless handsets. In addition to its space-saving features, stacked SDRAM offers the additional benefit of reduced power consumption – always an important consideration for mobile device designers.

The OMAP850 processor is an integral part of the TCS3500 EDGE chipset solution.

OMAP850 Features:
Low-Power, High-Performance CMOS Technology

Low-voltage 130 nm technology
1.1 – 1.5V cores, 1.8 – 2.75V IO
Extremely low power consumption: less than 10 µA in standby mode
Split power supplies for application processing, digital baseband and real-time clock enable precise control over power consumption
Optimized clocking and power management: Only two clocks required at 13 MHz and 32 kHz
ARM926TEJ Core Subsystem

ARM926EJ-S V5 architecture up to 200 MHz (maximum frequency)
16 kB I-cache; 8 kB D-cache
Java acceleration in hardware
Multimedia instruction set architecture (ISA) extension
EDGE Digital Baseband Subsystem

384 K-bytes internal SRAM
E-OTD and TTY support
Quad vocoder with EFR, FR, HR, AMR
GSM ultra-low power device (ULPD)
SIM interface
Application Subsystem

Supports all leading operating systems
DMA with 4 physical and 17 logical channels and a dedicated 2D graphics engine
Programmable GPIO keyboard interface
54-Mbps WLAN interface
Security acceleration in hardware:
Secure bootloader
48 kB of secure ROM
16 kB of secure RAM
Hardware acceleration for security standards and random number generator
Unique die ID cell
Third-party Security software library
Enhanced audio controller (EAC)
Comprehensive memory controller for interfaces to:
128 MB of mobile SDRAM
256 MB Flash
NAND Flash controllers
1.6 Mb ISRAM
SD/MMC/SDIO interface
Enhanced Trace Module for debug
LCD controller
uWire
SPI
1-wire and HDQ interface
Bluetooth data/audio interface
USB On-the-Go
Two high-speed 3.68 MHz UARTs
Fast IrDA (FIR)
Two 32-bit timers
Parallel camera port
Programmable three-color LED pulse generation
I²C master/slave controller
SmartCard interface
289-ball, 12 mm x 12 mm MicroStar BGA™ Package